Gas Flow Hollow Cathode (GFHC0 Sputter Deposition has been shown to be ideal methodology for depositing a wide range of materials that benefit from high deposition rates, low deposition energy, and low substrate temperature. The low deposition energy and substrate temperature reduce coating defects as compared to conventional sputtering and allow deposition on plastics. Gas flow through the cathode protects the cathode from the reactive gases introduced into the chamber and allows reactive deposition of metal compounds, like oxides, nitrides, selenides, and tellurides, with deposition rates competitive with the deposition rates of bare metals. The GFHC is also applicable to pure metal depositions.

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